Knowledge Based Technical Consultancy Ltd.
Riverview, West Charleton, Kingsbridge, Devon, TQ7 2AB U.K.
Tel: +44 (0) 1548 531414,
Mobile: +44 (0) 7791 595217,
Fax: +44 (0) 1548 531986
Home
Company
Service details
No Information Yet
Up to 8-inch wafer sawn on two sites.
Automated sawing / offload of wafers from 3" to 8" diameter using DISCO DFD640
Sawing of 100mm to 200mm silicon wafers using pattern recognition and automated handling with standard and UV tape.
Wafer offload via pick & place system also available
Up to 8 “ diameter . 3 automatic dicing saw machines
Wafer sawing, dicing, drilling, grinding & millng machine design and build and full sub-contract service. Specialist singulation by thinning service. Miliemetric and micro-machining process development available. Sawing consumables and air bearing design and manufacture
Up to 8-inch wafer sawn on two sites.
Sawing of thinned wafers (up to 100µm) with Disco double spindle machine
Where can I find Wafer Sawing..?
If you are... a company who offers these types of service and you are not listed, please follow this link to submit your details online
Wafer Sawing
The action of singulating a wafer into individual die. This is usually accomplished using a blade, but singulation by laser cut may also be used.