Knowledge Based Technical Consultancy Ltd.
Riverview, West Charleton, Kingsbridge, Devon, TQ7 2AB U.K.
Tel: +44 (0) 1548 531414,
Mobile: +44 (0) 7791 595217,
Fax: +44 (0) 1548 531986
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Frequently Asked Questions Page
The Die Products User Club will attempt to answer general questions about services to the Die Products Industry.
Answers will be posted on this page.
If you wish to ask a question, please use the response form
N.B. Questions presented here result from real enquiries to the DPUC helpline, web site or to KBTeC. Answers provided are for guidance only and should not be relied on etc. etc. (weasel words)
Die handling
Q. I have die supplied in Gel-Pak but can only use waffle packs on the placement machine. What would you advise?
A. Die supplied in Gel-Pak are often particularly fragile components such as opto or RF products that require special handling and protection. A Gel-Pak must be placed on a fixture that can draw a vacuum under the tray to allow release of the die. Once the vacuum is applied, the Gel-Pak die can be picked from the surface by a pick-up nozzle or collet. It is possible to transfer the parts into waffle pack and most die processors offering Wafer Offload services should be able to do this. However, waffle packs do not offer the same degree of protection to the die since they are free to move in the pocket.
Die/Wafer Storage
Q. Where can I find information about recommended storage conditions for Die and Wafers.
A. Semiconductor manufacturers may have a generic specification for Bare Die and Wafer shipping form which should include guidelines for short-term storage. Where these are available, they should be followed in the first instance. For general guidelines, including intentional long-term storage, refer to the Technical Report IEC/TR 62258 part 3 - Recommendations for good practice in handling, packing and storage. Note, however, that this document gives guidelines only and not be used as a specification to define storage conditions.
Wafer sawing
Q. We have a SoS (Silicon on Sapphire) wafer that requires sawing. Can you advise of a company where it could be sawn?
A. SoS is best sawn by a company who has experience of sawing this type of material, since it requires special blades and saw conditions. Some saw manufacturers also offer a service for sawing prototype quantities of wafers and they are most likely to have the expertise to saw it correctly. The DPUC web site has a list of companies offering sawing as a sub-contract service - www.kbtec.co.uk/dpuc/sawing.html